完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Lee, Yu-Min | en_US |
dc.contributor.author | Pan, Chi-Wen | en_US |
dc.contributor.author | Huang, Pei-Yu | en_US |
dc.contributor.author | Yang, Chi-Ping | en_US |
dc.date.accessioned | 2015-12-02T02:59:17Z | - |
dc.date.available | 2015-12-02T02:59:17Z | - |
dc.date.issued | 2015-08-01 | en_US |
dc.identifier.issn | 0278-0070 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/TCAD.2015.2401578 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/128007 | - |
dc.description.abstract | To sustain Moore\'s law, three-dimensional integrated circuit (3-D IC) is a promising solution to achieve high performance and low cost targets. However, its operating temperature is higher than that of a 2-D IC because of its high power density of stacked dies and ill of heat dissipation capability. Therefore, on-chip thermal effects have become major concerns of 3-D ICs. Utilizing look-up table approach, this paper, LUTSim, provides two thermal simulation engines, I-LUTSim and S-LUTSim, to efficiently calculate the thermal profile of a 3-D IC. I-LUTSim is suitable for full-chip thermal analysis, and S-LUTSim is suited for incremental-thermal updating. With utilizing the prebuilt tables, compared with a commercial tool ANSYS, the absolute error of I-LUTSim is less than 0.29%. Moreover, with negligible loss of accuracy, I-LUTSim can be 38.8 times faster than a well-known matrix solver SuperLU for performing full-chip thermal simulation. Besides, S-LUTSim can be over 1.05 million times faster than SuperLU for adjusting the thermal profile after inserting/removing a through silicon via. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | Look-up table | en_US |
dc.subject | thermal simulator | en_US |
dc.subject | three-dimensional integrated circuit (3-D IC) | en_US |
dc.title | LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/TCAD.2015.2401578 | en_US |
dc.identifier.journal | IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS | en_US |
dc.citation.volume | 34 | en_US |
dc.citation.spage | 1250 | en_US |
dc.citation.epage | 1263 | en_US |
dc.contributor.department | 電機資訊學士班 | zh_TW |
dc.contributor.department | Undergraduate Honors Program of Electrical Engineering and Computer Science | en_US |
dc.identifier.wosnumber | WOS:000358620700004 | en_US |
dc.citation.woscount | 0 | en_US |
顯示於類別: | 期刊論文 |