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dc.contributor.authorChang, Tai-Minen_US
dc.contributor.authorChen, Fu-Hsinen_US
dc.contributor.authorChen, Meng-Yenen_US
dc.contributor.authorWu, YewChung Sermonen_US
dc.date.accessioned2015-12-02T02:59:21Z-
dc.date.available2015-12-02T02:59:21Z-
dc.date.issued2015-01-01en_US
dc.identifier.issn2162-8769en_US
dc.identifier.urihttp://dx.doi.org/10.1149/2.0071509jssen_US
dc.identifier.urihttp://hdl.handle.net/11536/128096-
dc.description.abstractHigh thermal resistance of LED die-attached (DA) material degraded LED\'s performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305. (C) 2015 The Electrochemical Society. All rights reserved.en_US
dc.language.isoen_USen_US
dc.titleReducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt% Ag-0.5 wt% Cu Solderen_US
dc.typeArticleen_US
dc.identifier.doi10.1149/2.0071509jssen_US
dc.identifier.journalECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGYen_US
dc.citation.spageR140en_US
dc.citation.epageR143en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000358991700010en_US
dc.citation.woscount0en_US
Appears in Collections:Articles


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