Reducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt% Ag-0.5 wt% Cu Solder

doi:10.1149/2.0071509jss

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Chang, Tai-Min	en_US
dc.contributor.author	Chen, Fu-Hsin	en_US
dc.contributor.author	Chen, Meng-Yen	en_US
dc.contributor.author	Wu, YewChung Sermon	en_US
dc.date.accessioned	2015-12-02T02:59:21Z	-
dc.date.available	2015-12-02T02:59:21Z	-
dc.date.issued	2015-01-01	en_US
dc.identifier.issn	2162-8769	en_US
dc.identifier.uri	http://dx.doi.org/10.1149/2.0071509jss	en_US
dc.identifier.uri	http://hdl.handle.net/11536/128096	-
dc.description.abstract	High thermal resistance of LED die-attached (DA) material degraded LED\'s performance. To reduce the DA material resistance, three kinds of diamond particles were used to mix with Sn-3wt%Ag-0.5wt%Cu solder (SAC305) solder. It was found that neither bare diamond particle nor Ti-coated diamond particle could be used. On the other hand, the thermal resistance was reduced by using Ni-coated diamond particle with SAC305. (C) 2015 The Electrochemical Society. All rights reserved.	en_US
dc.language.iso	en_US	en_US
dc.title	Reducing the Thermal Resistance of LED Die-Attach Material Using Ni-Coated Diamond Mixed with Sn-3 wt% Ag-0.5 wt% Cu Solder	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1149/2.0071509jss	en_US
dc.identifier.journal	ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY	en_US
dc.citation.spage	R140	en_US
dc.citation.epage	R143	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000358991700010	en_US
dc.citation.woscount	0	en_US
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