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dc.contributor.authorChou, Chia-Hsinen_US
dc.contributor.authorChan, Wei-Shengen_US
dc.contributor.authorWu, Chun-Yuen_US
dc.contributor.authorLee, I-Cheen_US
dc.contributor.authorLiao, Ta-Chuanen_US
dc.contributor.authorWang, Chao-Lungen_US
dc.contributor.authorWang, Kuang-Yuen_US
dc.contributor.authorCheng, Huang-Chungen_US
dc.date.accessioned2015-12-02T02:59:24Z-
dc.date.available2015-12-02T02:59:24Z-
dc.date.issued2015-08-01en_US
dc.identifier.issn0021-4922en_US
dc.identifier.urihttp://dx.doi.org/10.7567/JJAP.54.084201en_US
dc.identifier.urihttp://hdl.handle.net/11536/128161-
dc.description.abstractIn this work, a novel gate-all-around (GAA) low-temperature poly-Si (LTPS) junctionless (JL) silicon-oxide-nitride-oxide-silicon (SONOS) nonvolatile memory device with a field-enhanced nanowire (NW) structure has been proposed to improve the programing/erasing (P/E) performance. Each nanowire has three sharp corners fabricated by a sidewall spacer formation technique to obtain high local electrical fields. Owing to the higher carrier concentration in the channel and the high local electrical field from the three sharp corners, such a JL SONOS memory device exhibits a significantly enhanced P/E speed, a larger memory window, and better data retention properties than a conventional inversion mode NW-channel memory device. (C) 2015 The Japan Society of Applied Physicsen_US
dc.language.isoen_USen_US
dc.titleNovel junctionless silicon-oxide-nitride-oxide-silicon memory devices with field-enhanced poly-Si nanowire structureen_US
dc.typeArticleen_US
dc.identifier.doi10.7567/JJAP.54.084201en_US
dc.identifier.journalJAPANESE JOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume54en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000360165000022en_US
dc.citation.woscount0en_US
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