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dc.contributor.authorChen, Yi-Hsuanen_US
dc.contributor.authorMa, William Cheng-Yuen_US
dc.contributor.authorChao, Tien-Shengen_US
dc.date.accessioned2015-12-02T02:59:28Z-
dc.date.available2015-12-02T02:59:28Z-
dc.date.issued2015-10-01en_US
dc.identifier.issn0268-1242en_US
dc.identifier.urihttp://dx.doi.org/10.1088/0268-1242/30/10/105017en_US
dc.identifier.urihttp://hdl.handle.net/11536/128243-
dc.description.abstractIn this paper, an ultra-thin-body thin-film transistor (UTB-TFT) with a raised source/drain structure is demonstrated and compared with a conventional thin-film transistor. A significant suppression of leakage current and an improvement in subthreshold swing (SS) resulting from the reduced body thickness is observed. The minimum current can be decreased from 245 pA to 42 pA as the channel film thickness is scaled down from 60 nm to 10 nm. However, an ultra-thin-channel film constrains the average grain size and severely impacts the saturation current. Fortunately, by decreasing the gate oxide thickness from 20 nm to 10 nm, the saturation current of a UTB-TFT can be significantly increased from 13 mu A to 25 mu A. Experimental results suggest that UTB-TFTs with a sub-10 nm gate oxide display great promise for future low-power, high-performance three-dimensional integrated circuits.en_US
dc.language.isoen_USen_US
dc.subjectthin-film transistorsen_US
dc.subjectultra-thin bodyen_US
dc.subjectraised source/drainen_US
dc.titleHigh-performance poly-Si TFT with ultra-thin channel film and gate oxide for low-power applicationen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/0268-1242/30/10/105017en_US
dc.identifier.journalSEMICONDUCTOR SCIENCE AND TECHNOLOGYen_US
dc.citation.volume30en_US
dc.citation.issue10en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000362602300025en_US
dc.citation.woscount0en_US
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