標題: | A Fully-Integrated Wireless Bondwire Accelerometer With Closed-loop Readout Architecture |
作者: | Liao, Yu-Te Huang, Shih-Chieh Cheng, Fu-Yuan Tsai, Tsung-Heng 電機資訊學士班 Undergraduate Honors Program of Electrical Engineering and Computer Science |
關鍵字: | Bondwire;CMOS;inertial sensing;resonant accelerometer;wireless accelerometer |
公開日期: | 1-十月-2015 |
摘要: | This paper presents a fully-integrated wireless bondwire accelerometer using a closed-loop readout interface that effectively reduces the noise from electrical circuits and long-term frequency drifts. The proposed accelerometer was fabricated using 0.18-mu m CMOS technology without micro electromechanical systems (MEMS) processing. To reduce manufacturing errors, the bondwire inertial sensors are wire-bonded on the chip pads, thereby enabling a precisely-defined length and space between sensing bondwires. The proposed wireless accelerometer using a pair of 15.2 mu m and 25.4 mu m bondwires achieves a linear transducer gain of 33 mV/g, bandwidth of 5 kHz, a noise floor of 700 mu g/root Hz, and 4.5 mu g bias stability. The acceleration data is digitalized by an energy-efficient 10-bit SAR ADC and then wirelessly transmitted in real time to the external reader by a low-power on-off shift keying (OOK) transmitter. The proposed architecture consumes 9 mW and the chip area is 2 mm x 2.4 mm. |
URI: | http://dx.doi.org/10.1109/TCSI.2015.2471595 http://hdl.handle.net/11536/128257 |
ISSN: | 1549-8328 |
DOI: | 10.1109/TCSI.2015.2471595 |
期刊: | IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS |
Volume: | 62 |
Issue: | 10 |
起始頁: | 2445 |
結束頁: | 2453 |
顯示於類別: | 期刊論文 |