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dc.contributor.authorChand, Umeshen_US
dc.contributor.authorHuang, Kuan-Changen_US
dc.contributor.authorHuang, Chun-Yangen_US
dc.contributor.authorTseng, Tseung-Yuenen_US
dc.date.accessioned2015-12-02T02:59:37Z-
dc.date.available2015-12-02T02:59:37Z-
dc.date.issued2015-11-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2015.2471835en_US
dc.identifier.urihttp://hdl.handle.net/11536/128383-
dc.description.abstractIn this paper, the nonlinear switching mechanism of the Ti/HfO2/Al2O3/TiN crossbar structure resistive random access memory device with good reliability is investigated. The nonlinearity of the device can be revealed by inserting a large bandgap of an Al2O3 thin layer between the TiN bottom electrode and the HfO2 switching film. The nonlinear switching mechanism caused by Flower-Nordheim tunneling involves the tunneling barrier of the Al2O3 layer. Besides, the nonlinear behavior is also sensitive to the thickness of the inserting Al2O3 layer. A high nonlinear factor of 37, large endurance more than 10(4), and good retention properties are achieved in the Ti/HfO2/Al2O3 (1-nm)/TiN structure.en_US
dc.language.isoen_USen_US
dc.subjectDouble layeren_US
dc.subjectHfO2en_US
dc.subjectnonlinearen_US
dc.subjectresistive random access memory (RRAM)en_US
dc.subjectresistive switchingen_US
dc.subjecttunneling barrieren_US
dc.titleMechanism of Nonlinear Switching in HfO2-Based Crossbar RRAM With Inserting Large Bandgap Tunneling Barrier Layeren_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2015.2471835en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume62en_US
dc.citation.issue11en_US
dc.citation.spage3665en_US
dc.citation.epage3670en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000364242000031en_US
dc.citation.woscount0en_US
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