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dc.contributor.authorChou, Lei-Chunen_US
dc.contributor.authorLee, Shih-Weien_US
dc.contributor.authorCheng, Chuan-Anen_US
dc.contributor.authorHuang, Po-Tsangen_US
dc.contributor.authorChang, Chih-Weien_US
dc.contributor.authorChiang, Cheng-Haoen_US
dc.contributor.authorWu, Shang-Linen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.contributor.authorChiou, Jin-Chernen_US
dc.contributor.authorHwang, Weien_US
dc.contributor.authorWu, Chung-Hsien_US
dc.contributor.authorChen, Kuo-Huaen_US
dc.contributor.authorChiu, Chi-Tsungen_US
dc.contributor.authorTong, Ho-Mingen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.date.accessioned2015-12-02T03:00:54Z-
dc.date.available2015-12-02T03:00:54Z-
dc.date.issued2014-01-01en_US
dc.identifier.isbn978-1-4799-2217-8en_US
dc.identifier.issnen_US
dc.identifier.urihttp://hdl.handle.net/11536/128528-
dc.description.abstractHighly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.en_US
dc.language.isoen_USen_US
dc.subjectTSVen_US
dc.subjectCMOS MEMSen_US
dc.subjectBio-Signal Probeen_US
dc.titleA TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe Arrayen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF TECHNICAL PROGRAM - 2014 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA)en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000358865800053en_US
dc.citation.woscount0en_US
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