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dc.contributor.authorCHANG Lien_US
dc.contributor.authorCHEN Jr-Yuen_US
dc.contributor.authorCHEN Wei-Chunen_US
dc.contributor.authorLIN Pei-Yinen_US
dc.date.accessioned2015-12-04T07:03:12Z-
dc.date.available2015-12-04T07:03:12Z-
dc.date.issued2015-08-20en_US
dc.identifier.govdocH01L021/02zh_TW
dc.identifier.govdocH01L029/04zh_TW
dc.identifier.govdocH01L029/20zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/128682-
dc.description.abstractA method for growing aluminum indium nitride (AlInN) films on silicon substrates comprises several steps: firstly, arranging a silicon substrate in a reaction chamber; secondly, providing multiple reaction gases in the reaction chamber, wherein the reaction gases include aluminum precursors, indium precursors and nitrogen-containing gases; finally, dynamically adjusting flow rates of the reaction gases and directly growing an AlInN layer on the silicon substrate via a crystal growth process. By directly forming an AlInN layer on the silicon substrate, lattice matching is increased, residual thermal stress is reduced and film quality is improved. In addition, fabrication process is simplified and thus cost is reduced.zh_TW
dc.language.isozh_TWen_US
dc.titleMETHOD FOR GROWING ALUMINUM INDIUM NITRIDE FILMS ON SILICON SUBSTRATEzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20150235837zh_TW
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