完整後設資料紀錄
DC 欄位語言
dc.contributor.authorLu, I-Teen_US
dc.contributor.authorHsieh, Yu-Chien_US
dc.contributor.authorChen, Po-Chunen_US
dc.contributor.authorWu, Pu-Weien_US
dc.date.accessioned2016-03-28T00:04:20Z-
dc.date.available2016-03-28T00:04:20Z-
dc.date.issued2015-12-01en_US
dc.identifier.issn1452-3981en_US
dc.identifier.urihttp://hdl.handle.net/11536/129565-
dc.description.abstractElectrochemical Quartz Crystal Microbalance (EQCM) was used to investigate the events occurring during current-on (T-on) and current-off (T-off) for pulse current electrodeposition of Pt in both air and Ar atmospheres. The EQCM profiles indicated a transient mass loss when the current was turned on, followed by a linear mass gain associated with the Pt electrodeposition from the H2PtCl6 plating bath. During the T-off, the mass revealed a steady increase until it leveled off after 10 sec. The minute transient mass loss during the initial stage of T-on was attributed to the reduction of the adsorbed PtCl62- whereas the mass gain during the T-off was due to the absorption of PtCl62- onto the freshly-deposited Pt surface. In air atmosphere, the parasitic oxygen reduction reaction consumed part of the reduction current and thus, reduced the Pt plating efficiency by 6%. In addition, smaller mass gains during T-off and T-on were observed for the Pt plating in air atmosphere.en_US
dc.language.isoen_USen_US
dc.subjectPulse Current Electrodepositionen_US
dc.subjectEQCMen_US
dc.subjectPlatinumen_US
dc.subjectElectrodeposition Efficiencyen_US
dc.titleEQCM Study on Pulse Current Pt Electrodepositionen_US
dc.typeArticleen_US
dc.identifier.journalINTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCEen_US
dc.citation.volume10en_US
dc.citation.issue12en_US
dc.citation.spage10199en_US
dc.citation.epage10209en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.department生醫電子轉譯研究中心zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.contributor.departmentBiomedical Electronics Translational Research Centeren_US
dc.identifier.wosnumberWOS:000366307100034en_US
dc.citation.woscount0en_US
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