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dc.contributor.authorWu, P. R.en_US
dc.contributor.authorChao, T. Y.en_US
dc.contributor.authorCheng, Y. T.en_US
dc.date.accessioned2016-03-28T00:04:20Z-
dc.date.available2016-03-28T00:04:20Z-
dc.date.issued2015-12-01en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttp://dx.doi.org/10.1088/0960-1317/25/12/125026en_US
dc.identifier.urihttp://hdl.handle.net/11536/129566-
dc.description.abstractThe paper presents a CMOS compatible pulse-electroplating technique combined with a low temperature bonding process for the synthesis of CoNiMnP-AAO (anodic alumina oxide) nanocomposite films and the fabrication of stacked composite permanent magnets (PMs). The magnetic nanocomposite film exhibits the best characteristics of the coercivity of 2472 Oe, remanence of 4000 G, and (BH)(max) of 16.13 kJ m(-3), in the existing CoNiMnP systems. Meanwhile, a surface magnetic flux density of 9.2 mT generated by a 15-layer-stacked composite PM with a volume of 9 mm(3) has shown the potential for various magnetic microelectromechanical systems (MEMS) fabrication using the nanocomposite material.en_US
dc.language.isoen_USen_US
dc.subjectnanocomposite permanent magneten_US
dc.subjectCoNiMnP-AAOen_US
dc.subjectstackeden_US
dc.subjectlow temperature bondingen_US
dc.titleStacked pulse-electroplated CoNiMnP-AAO nanocomposite permanent magnets for MEMSen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/0960-1317/25/12/125026en_US
dc.identifier.journalJOURNAL OF MICROMECHANICS AND MICROENGINEERINGen_US
dc.citation.volume25en_US
dc.citation.issue12en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000366868400029en_US
dc.citation.woscount0en_US
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