Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yu, Chang-Hung | en_US |
dc.contributor.author | Fan, Ming-Long | en_US |
dc.contributor.author | Yu, Kuan-Chin | en_US |
dc.contributor.author | Hu, Vita Pi-Ho | en_US |
dc.contributor.author | Su, Pin | en_US |
dc.contributor.author | Chuang, Ching-Te | en_US |
dc.date.accessioned | 2016-03-28T00:04:24Z | - |
dc.date.available | 2016-03-28T00:04:24Z | - |
dc.date.issued | 2016-02-01 | en_US |
dc.identifier.issn | 0018-9383 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1109/TED.2015.2505064 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/129639 | - |
dc.description.abstract | For the first time, we comprehensively evaluate 6T SRAM stability and performance using monolayer and bilayer transition metal dichalcogenide (TMD) devices based on the ITRS 2028 (5.9 nm) node. Our study indicates that, with excellent device electrostatics and superior stability, the monolayer TMD is favored for low-power SRAM applications, while the bilayer TMD, with higher carrier mobility, is more suitable for relaxed channel length and high-performance SRAM applications. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | 2-D materials | en_US |
dc.subject | bilayer | en_US |
dc.subject | monolayer | en_US |
dc.subject | SRAM cell | en_US |
dc.subject | transition metal dichalcogenide (TMD) | en_US |
dc.title | Evaluation of Monolayer and Bilayer 2-D Transition Metal Dichalcogenide Devices for SRAM Applications | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1109/TED.2015.2505064 | en_US |
dc.identifier.journal | IEEE TRANSACTIONS ON ELECTRON DEVICES | en_US |
dc.citation.volume | 63 | en_US |
dc.citation.spage | 625 | en_US |
dc.citation.epage | 630 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000369304700015 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Articles |