完整後設資料紀錄
DC 欄位語言
dc.contributor.authorYu, Chang-Hungen_US
dc.contributor.authorFan, Ming-Longen_US
dc.contributor.authorYu, Kuan-Chinen_US
dc.contributor.authorHu, Vita Pi-Hoen_US
dc.contributor.authorSu, Pinen_US
dc.contributor.authorChuang, Ching-Teen_US
dc.date.accessioned2016-03-28T00:04:24Z-
dc.date.available2016-03-28T00:04:24Z-
dc.date.issued2016-02-01en_US
dc.identifier.issn0018-9383en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TED.2015.2505064en_US
dc.identifier.urihttp://hdl.handle.net/11536/129639-
dc.description.abstractFor the first time, we comprehensively evaluate 6T SRAM stability and performance using monolayer and bilayer transition metal dichalcogenide (TMD) devices based on the ITRS 2028 (5.9 nm) node. Our study indicates that, with excellent device electrostatics and superior stability, the monolayer TMD is favored for low-power SRAM applications, while the bilayer TMD, with higher carrier mobility, is more suitable for relaxed channel length and high-performance SRAM applications.en_US
dc.language.isoen_USen_US
dc.subject2-D materialsen_US
dc.subjectbilayeren_US
dc.subjectmonolayeren_US
dc.subjectSRAM cellen_US
dc.subjecttransition metal dichalcogenide (TMD)en_US
dc.titleEvaluation of Monolayer and Bilayer 2-D Transition Metal Dichalcogenide Devices for SRAM Applicationsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TED.2015.2505064en_US
dc.identifier.journalIEEE TRANSACTIONS ON ELECTRON DEVICESen_US
dc.citation.volume63en_US
dc.citation.spage625en_US
dc.citation.epage630en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000369304700015en_US
dc.citation.woscount0en_US
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