| 標題: | Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications |
| 作者: | Chang, Chih-Wei Huang, Po-Tsang Chou, Lei-Chun Wu, Shang-Lin Lee, Shih-Wei Chuang, Ching-Te Chen, Kuan-Neng Chiou, Jin-Chern Hwang, Wei Lee, Yen-Chi Wu, Chung-Hsi Chen, Kuo-Hua Chiu, Chi-Tsung Tong, Ho-Ming 交大名義發表 National Chiao Tung University |
| 公開日期: | 1-Jan-2013 |
| 摘要: | |
| URI: | http://hdl.handle.net/11536/129817 |
| ISBN: | 978-1-4673-4513-2; 978-1-4673-4515-6 |
| ISSN: | 0193-6530 |
| 期刊: | 2013 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC) |
| Volume: | 56 |
| 起始頁: | 102 |
| 結束頁: | U882 |
| Appears in Collections: | Conferences Paper |
- A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications / Chang, Chih-Wei;Chou, Lei-Chun;Huang, Po-Tsang;Wu, Shang-Lin;Lee, Shih-Wei
- An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem / Hu, Yu-Chen;Huang, Yu-Chieh;Huang, Po-Tsang;Wu, Shang-Lin;Chang, Hsiao-Chun
- 2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications / Huang, Po-Tsang;Wu, Shang-Lin;Huang, Yu-Chieh;Chou, Lei-Chun;Huang, Teng-Chieh
- A 64-CHANNEL WIRELESS NEURAL SENSING MICROSYSTEM WITH TSV-EMBEDDED MICRO-PROBE ARRAY FOR NEURAL SIGNAL ACQUISITION / Huang, Yu-Chieh;Huang, Po-Tsang;Hu, Yu-Chen;Wu, Shang-Lin;You, Yan-Huei
- 利用矽穿孔技術整合微探針陣列以實現高品質神經訊號 擷取研究 / 周雷峻;Chou, Lei-Chun;邱俊誠;黃聖傑;Chiou, Jin-Chern
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