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dc.contributor.authorKao, HLen_US
dc.contributor.authorHung, BFen_US
dc.contributor.authorChin, Aen_US
dc.contributor.authorLai, JMen_US
dc.contributor.authorLee, CFen_US
dc.contributor.authorMcAlister, SPen_US
dc.contributor.authorChi, CCen_US
dc.date.accessioned2014-12-08T15:18:09Z-
dc.date.available2014-12-08T15:18:09Z-
dc.date.issued2005-11-01en_US
dc.identifier.issn1531-1309en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LMWC.2005.858999en_US
dc.identifier.urihttp://hdl.handle.net/11536/13121-
dc.description.abstractA very low minimum noise figure (NFmin) of 1.2 dB and a high associated gain of 12.8 dB at 10 GHz were measured for six-finger, 0.18-mu m radio frequency (RF) metal-oxide semiconductor field-effect transistors mounted on insulating plastic following substrate-thinning (similar to 30 mu m) and wafer transfer. Before this process, the devices had a slightly better RF performance of 1.1-dB NFmin anda 13.7-dB associated gain. The small RF performance degradation of the active transistors transferred to plastic shows the potential of integrating electronics onto plastic.en_US
dc.language.isoen_USen_US
dc.subjectassociated gainen_US
dc.subjectmetal-oxide semiconductor field-effect transistor (MOSFET)en_US
dc.subjectminimum noise figureen_US
dc.subjectplasticen_US
dc.subjectradio frequency (RF)en_US
dc.titleVery low noise RIF nMOSFETs on plastic by substrate thinning and wafer transferen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LMWC.2005.858999en_US
dc.identifier.journalIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERSen_US
dc.citation.volume15en_US
dc.citation.issue11en_US
dc.citation.spage757en_US
dc.citation.epage759en_US
dc.contributor.department奈米科技中心zh_TW
dc.contributor.departmentCenter for Nanoscience and Technologyen_US
dc.identifier.wosnumberWOS:000233208200013-
dc.citation.woscount2-
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