完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | 吳樸偉 | zh_TW |
dc.contributor.author | 陳柏均 | zh_TW |
dc.date.accessioned | 2016-12-20T03:56:45Z | - |
dc.date.available | 2016-12-20T03:56:45Z | - |
dc.date.issued | 2016 | en_US |
dc.identifier.govdoc | MOST105-2622-E009-008-CC2 | zh_TW |
dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=11882955&docId=486395 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/131827 | - |
dc.description.abstract | zh_TW | |
dc.description.abstract | en_US | |
dc.description.sponsorship | 科技部 | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.subject | zh_TW | |
dc.subject | en_US | |
dc.title | 植入式醫療電子元件生物相容性封裝製程開發( II ) | zh_TW |
dc.title | Development of Biocompatible Packaging Process for Medical Electronics Implants( II ) | en_US |
dc.type | Plan | en_US |
dc.contributor.department | 國立交通大學材料科學與工程學系(所) | zh_TW |
顯示於類別: | 研究計畫 |