完整後設資料紀錄
DC 欄位語言
dc.contributor.author柯明道zh_TW
dc.contributor.author陳柏宏zh_TW
dc.date.accessioned2016-12-20T03:56:47Z-
dc.date.available2016-12-20T03:56:47Z-
dc.date.issued2016en_US
dc.identifier.govdocMOST105-2221-E009-166 zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=11887657&docId=487717en_US
dc.identifier.urihttp://hdl.handle.net/11536/131859-
dc.description.abstract zh_TW
dc.description.abstract en_US
dc.description.sponsorship科技部 zh_TW
dc.language.isozh_TWen_US
dc.subject zh_TW
dc.subject en_US
dc.title混合信號積體電路之核心設計技術-總計畫暨子計畫五:積體電路可靠度設計zh_TW
dc.titleReliability Design for Mixed-Signal Integrated Circuitsen_US
dc.typePlanen_US
dc.contributor.department國立交通大學電子工程學系及電子研究所 zh_TW
顯示於類別:研究計畫