| 標題: | 電鍍奈米雙晶銅-銅接合?究 Cu-To-Cu Direct Bonding Using Electroplated Nanotwinned Cu |
| 作者: | 陳智 國立交通大學材料科學與工程學系（所） |
| 關鍵字: | ; |
| 公開日期: | 2016 |
| 摘要: | |
| 官方說明文件#: | MOST105-2221-E009-008-MY3 |
| URI: | https://www.grb.gov.tw/search/planDetail?id=11900860&docId=491464 http://hdl.handle.net/11536/131954 |
| 顯示於類別： | 研究計畫 |
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- Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper / Juang, Jing Ye;Shie, Kai Cheng;Li, Yu Jin;Tu, K. N.;Chen, Chih
- Fabrication and characterization of electroplated nanotwinned-copper films on polymer substrates(IMPACT-IAAC 2016) / Chang, Liang-Hsien;Chen, Chih;Hu, Dyi-Chung;Tain, Ray;Chen, Y. H.
- Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure / Wang, I-Ju;Ku, Ching-Shun;Tu-Ngoc Lam;Huang, E-Wen;Tu, K. N.
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