完整後設資料紀錄
DC 欄位語言
dc.contributor.authorTakahashi, Yuyaen_US
dc.contributor.authorChen, Linen_US
dc.contributor.authorOkajima, Junnosukeen_US
dc.contributor.authorIga, Yukaen_US
dc.contributor.authorKomiya, Atsukien_US
dc.contributor.authorFu, Wu-Shungen_US
dc.contributor.authorMaruyama, Shigenaoen_US
dc.date.accessioned2017-04-21T06:56:20Z-
dc.date.available2017-04-21T06:56:20Z-
dc.date.issued2016-12en_US
dc.identifier.issn1057-7157en_US
dc.identifier.urihttp://dx.doi.org/10.1109/JMEMS.2016.2613942en_US
dc.identifier.urihttp://hdl.handle.net/11536/132765-
dc.description.abstractIn this paper, microchannel heat sink cooling device utilizing supersonic gas flow with isentropic expansion has been designed and analyzed. The objective is to study the feasibility of the supersonic microchannel with bumped section design for electronics cooling. Numerical simulations on the designed microchannel flows and heat transfer analysis have been conducted (in conjunction with a supersonic air flow inside a heated fin array) and compared with experimental results in this paper. The performance of the designed microchannel is also compared with traditional Laval nozzles for the feasibility analysis. Under 350 and 330 K inlet temperature conditions, the calculated Nu number is found higher than pure through channel flows. The supersonic expanding flow is successfully generated with lower heat transfer temperatures and a simpler geometric shape. The design of 100-300 mu m is found to have highest heat transfer for integrated microchannel width selection. For electronics cooling tests, the newly designed supersonic channel is found sufficient for a cooling capacity around 1.4 MW/m(2). In addition, the supersonic flow and heat transfer characteristics are also discussed into detail in this paper. [2016-0037]en_US
dc.language.isoen_USen_US
dc.subjectElectronics coolingen_US
dc.subjectheat transferen_US
dc.subjectmicroscaleen_US
dc.subjectcomputational fluid dynamicsen_US
dc.subjectsupersonic flowen_US
dc.titleDesign and Feasibility Analysis of Microscale Bumped Channel With Supersonic Flow for Electronics Coolingen_US
dc.identifier.doi10.1109/JMEMS.2016.2613942en_US
dc.identifier.journalJOURNAL OF MICROELECTROMECHANICAL SYSTEMSen_US
dc.citation.volume25en_US
dc.citation.issue6en_US
dc.citation.spage1033en_US
dc.citation.epage1040en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000389898800006en_US
顯示於類別:期刊論文