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dc.contributor.authorWei, Yin-Changen_US
dc.contributor.authorLee, I-Cheen_US
dc.contributor.authorCheng, Huang-Chungen_US
dc.date.accessioned2017-04-21T06:56:08Z-
dc.date.available2017-04-21T06:56:08Z-
dc.date.issued2016-12en_US
dc.identifier.issn1533-4880en_US
dc.identifier.urihttp://dx.doi.org/10.1166/jnn.2016.13646en_US
dc.identifier.urihttp://hdl.handle.net/11536/132793-
dc.description.abstractA high-sensitivity lateral photodetector (PD) with an ultrathin absorption layer was fabricated by a low-temperature poly-silicon (LTPS) process via body-extension-contact (BEC) structure. The sensitivity of the LTPS PD with the BEC structure achieved a superior photo/dark current ratio of 105 compared to the ratio of 10(0.5) for the normal PD. Further, for the first time, the effect of photosensitivity and geometry on the ideality factor (n) was investigated in this study. The developed high-performance PD is suitable for application in image scanners, ambient light sensors, or devices embedded in larger area electronics.en_US
dc.language.isoen_USen_US
dc.subjectLow-Temperature Poly-Silicon (LTPS)en_US
dc.subjectPhotodetector (PD)en_US
dc.subjectBody-Extension-Contact (BEC) Structureen_US
dc.titleHigh-Sensitivity Low-Temperature Poly-Silicon Lateral Photodetector with Ultrathin Absorption Layer via Body-Extension-Contact Structureen_US
dc.identifier.doi10.1166/jnn.2016.13646en_US
dc.identifier.journalJOURNAL OF NANOSCIENCE AND NANOTECHNOLOGYen_US
dc.citation.volume16en_US
dc.citation.issue12en_US
dc.citation.spage12708en_US
dc.citation.epage12713en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000387279100088en_US
Appears in Collections:Articles