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dc.contributor.authorMihaychuk, JGen_US
dc.contributor.authorDenhoff, MWen_US
dc.contributor.authorMcAlister, SPen_US
dc.contributor.authorMcKinnon, WRen_US
dc.contributor.authorChin, Aen_US
dc.date.accessioned2014-12-08T15:18:24Z-
dc.date.available2014-12-08T15:18:24Z-
dc.date.issued2005-09-01en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2031946en_US
dc.identifier.urihttp://hdl.handle.net/11536/13280-
dc.description.abstractIn addition to Si band-edge electroluminescence (EL) near 1.1 eV, we observe hot-electron EL in metal-insulator-silicon tunnel diodes that can span a detector-limited range from 0.7 to 2.6 eV (1780-480 nm). The maximum photon energy increases with increasing forward bias. In one implementation, sub-micron-sized EL sites appear during the forward-bias stress. The number of sites grows linearly with the current, consistent with the dielectric breakdown of the insulator. We compare the poststress current-voltage data with the quantum-point-contact model. Results are presented for various p-type Si(100) devices having 2-8-nm-thick SiO2, Al2O3, and HfOxNy insulators. We also describe devices in which electron-beam lithography of an 18-nm-thick SiO2 is used to define EL sites. (c) 2005 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleBroad-spectrum light emission at microscopic breakdown sites in metal-insulator-silicon tunnel diodesen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2031946en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume98en_US
dc.citation.issue5en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000231885600066-
dc.citation.woscount3-
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