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dc.contributor.authorWu, HSen_US
dc.contributor.authorYang, HJen_US
dc.contributor.authorPeng, CJen_US
dc.contributor.authorTzuang, CKCen_US
dc.date.accessioned2014-12-08T15:18:29Z-
dc.date.available2014-12-08T15:18:29Z-
dc.date.issued2005-09-01en_US
dc.identifier.issn0018-9480en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TMTT.2005.854193en_US
dc.identifier.urihttp://hdl.handle.net/11536/13298-
dc.description.abstractThis paper presents a novel approach to miniaturizing a transmission-line (TL)-based bandpass filter (BPF). The BPF is miniaturized by incorporating multilayer stacked synthetic quasi-TEM TLs made of complementary conducting strip (CCS) metal surfaces. The stacked CCS TLs are separated by a meshed ground plane, whose coupling effect was experimentally shown negligibly to affect desired circuit performance. A brief description of the symmetric third-order TL filter synthesis procedure is reported to map such an idealized BPF to the prototype made of the stacked synthetic CCS TLs. Excellent agreement is obtained by comparing the experimental and theoretical filter frequency responses showing a 2.46-dB insertion loss, a -16.8-dB return loss with under 5% offset of low-side out-band transmission zeros, and a 2% offset of center frequency. A quick estimate of the proposed miniaturized filter design based on synthetic quasi-TEM lines shows that the particular filter prototype approaches the process limit.en_US
dc.language.isoen_USen_US
dc.subjectbandpass filter (BPF)en_US
dc.subjectmultilayeren_US
dc.subjectmultistandarden_US
dc.subjectRF system-on-chip (SOC)en_US
dc.subjectsynthetic transmission line (TL)en_US
dc.subjectsystem-in-package (SIP)en_US
dc.subjectwireless local area network (WLAN)en_US
dc.titleMiniaturized microwave passive filter incorporating multilayer synthetic quasi-TEM transmission lineen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1109/TMTT.2005.854193en_US
dc.identifier.journalIEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESen_US
dc.citation.volume53en_US
dc.citation.issue9en_US
dc.citation.spage2713en_US
dc.citation.epage2720en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000231721300011-
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