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dc.contributor.authorLin, Huang-Yuen_US
dc.contributor.authorYe, Zhi-Tingen_US
dc.contributor.authorLin, Chien-Chungen_US
dc.contributor.authorChen, Kuo-Juen_US
dc.contributor.authorTu, Hsien-Haoen_US
dc.contributor.authorChen, Huang-Mingen_US
dc.contributor.authorChen, Cheng-Huanen_US
dc.contributor.authorKuo, Hao-Chungen_US
dc.date.accessioned2019-04-03T06:44:33Z-
dc.date.available2019-04-03T06:44:33Z-
dc.date.issued2016-01-25en_US
dc.identifier.issn1094-4087en_US
dc.identifier.urihttp://dx.doi.org/10.1364/OE.24.00A341en_US
dc.identifier.urihttp://hdl.handle.net/11536/133063-
dc.description.abstractA novel combination of blue LED chips, transparent glass substrates and phosphors with PDMS thin film is demonstrated. The flip-chip bonding technology is applied to facilitate this design. The ZrO2 nanoparticles are also doped into the PDMS film to increase light scattering. The resultant luminous efficiency shows an 11% enhancement when compared to the regular COG device. The variation of correlated color temperature of such devices is also reduced to 132K. In addition to these changes, the surface temperature is reduced from 121 degrees C to 104 degrees C due to good thermal dissipation brought by ZrO2 nanoparticles. (C) 2015 Optical Society of Americaen_US
dc.language.isoen_USen_US
dc.titleImprovement of light quality by ZrO2 film of chip on glass structure white LEDen_US
dc.typeArticleen_US
dc.identifier.doi10.1364/OE.24.00A341en_US
dc.identifier.journalOPTICS EXPRESSen_US
dc.citation.volume24en_US
dc.citation.issue2en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department光電系統研究所zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.department光電工程研究所zh_TW
dc.contributor.departmentInstitute of Photonic Systemen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of EO Enginerringen_US
dc.identifier.wosnumberWOS:000369066300031en_US
dc.citation.woscount6en_US
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