完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChen, Kai-Huangen_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorLiao, Kuo-Hsiaoen_US
dc.contributor.authorSyu, Yong-Enen_US
dc.contributor.authorSze, Simon M.en_US
dc.date.accessioned2017-04-21T06:55:49Z-
dc.date.available2017-04-21T06:55:49Z-
dc.date.issued2016-03en_US
dc.identifier.issn0947-8396en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s00339-016-9768-5en_US
dc.identifier.urihttp://hdl.handle.net/11536/134080-
dc.description.abstractTo effectively lower the power consumption effect of Sn:SiO2 RRAM devices, the electrical hopping conduction mechanism for set/reset state was effectively used and achieved by different constant compliance current forming process. To assume and discuss the tin metal clustered reaction and electron transport behaviors in metallic filament path-forming model, the various electrical switching current and conduction mechanism model of the Sn:SiO2 RRAM devices for different constant compliance current were also investigated and described. Finally, the switching current relationship between hopping conduction energy and average inter-trap distance properties of the RRAM devices was also simulated and demonstrated in this study.en_US
dc.language.isoen_USen_US
dc.titleEffect of different constant compliance current for hopping conduction distance properties of the Sn:SiOx thin film RRAM devicesen_US
dc.identifier.doi10.1007/s00339-016-9768-5en_US
dc.identifier.journalAPPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSINGen_US
dc.citation.volume122en_US
dc.citation.issue3en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000371041700087en_US
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