完整後設資料紀錄
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dc.contributor.authorKao, Yu-Chengen_US
dc.contributor.authorOu, Sin-Liangen_US
dc.contributor.authorWu, Fan-Leien_US
dc.contributor.authorHorng, Ray-Huaen_US
dc.date.accessioned2017-04-21T06:55:39Z-
dc.date.available2017-04-21T06:55:39Z-
dc.date.issued2016-08-01en_US
dc.identifier.issn0040-6090en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.tsf.2016.05.045en_US
dc.identifier.urihttp://hdl.handle.net/11536/134123-
dc.description.abstractInGaP/GaAs dual-junction solar cells were prepared on p-type GaAs substrates by metalorganic chemical vapor deposition. Three types of front-side electrodes, which included AuGe/Au metal-finger, ITO-finger, and ITO-overcoated, were individually fabricated on the devices and denoted as samples A, B, and C, respectively. The thickness of ITO film is 200 nm, and its transmittance can reach 99% in the visible region. Based on the current density-voltage (J-V) measurement, the short-circuit current density (J(sc)) of samples A, B, and C are 8.13, 9.35, and 10.90 mA/cm(2), while the conversion efficiencies of these three samples are evaluated to be 15.45%, 18.14%, and 20.24%, respectively. This reveals that sample C possesses 31.0% enhancement in the conversion efficiency compared to that of sample A. Additionally, the series resistances (Rs) of samples A, B, and C are 21.43, 22.94, and 6.71 Omega-cm(2), respectively. The lowest Rs occurred in sample C can be attributed to the elimination of the lateral resistance between electrodes because this device was fabricated with the ITO-overcoated front-side electrode. In sample C, since the ITO front-side electrode can cover overall surface of the device, all regions on the sample surface can extract the electrons, leading to the highest J(sc). (C) 2016 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectInGaP/GaAs dual-junction solar cellsen_US
dc.subjectITO-fingeren_US
dc.subjectITO-overcoateden_US
dc.titlePerformance enhancement of III-V multi-junction solar cells using indium-tin-oxide electrodesen_US
dc.identifier.doi10.1016/j.tsf.2016.05.045en_US
dc.identifier.journalTHIN SOLID FILMSen_US
dc.citation.volume612en_US
dc.citation.spage36en_US
dc.citation.epage40en_US
dc.contributor.department電機學院zh_TW
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000380511900006en_US
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