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dc.contributor.authorFu, Yunen_US
dc.contributor.authorTsai, Chen-Chuen_US
dc.contributor.authorTsai, Jia-Linen_US
dc.date.accessioned2017-04-21T06:55:15Z-
dc.date.available2017-04-21T06:55:15Z-
dc.date.issued2016-10en_US
dc.identifier.issn0946-7076en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s00542-015-2642-0en_US
dc.identifier.urihttp://hdl.handle.net/11536/134201-
dc.description.abstractThe stress distribution of a flexible active-matrix organic light-emitting diode (AMOLED) display during the debonding process was investigated using finite element analysis. During the fabrication of an AMOLED display, an AMOLED with a polyimide (PI) substrate is detached from a glass carrier; this is a critical process and generally results in failure of the AMOLED. To enhance the yielding rate of AMOLEDs, their stress states generated during the debonding process must be reduced. The interfacial fracture behavior between the PI substrate and glass carrier was characterized on the basis of bimaterial fracture mechanics, and the fracture toughness associated with mode mixity determined through peeling tests was considered a criterion for detaching the AMOLED from the glass carrier. The stress distribution of the AMOLED at the inception of debonding crack extension was evaluated according to fracture toughness. In addition, the parameters possibly influencing the stress states of the AMOLED in the debonding process are discussed.en_US
dc.language.isoen_USen_US
dc.titleCharacterizing mechanical behaviors of a flexible AMOLED during the debonding processen_US
dc.identifier.doi10.1007/s00542-015-2642-0en_US
dc.identifier.journalMICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMSen_US
dc.citation.volume22en_US
dc.citation.issue10en_US
dc.citation.spage2397en_US
dc.citation.epage2406en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000384423700004en_US
Appears in Collections:Articles