完整後設資料紀錄
DC 欄位語言
dc.contributor.authorPan, Chih-Hungen_US
dc.contributor.authorChang, Ting-Changen_US
dc.contributor.authorTsai, Tsung-Mingen_US
dc.contributor.authorChang, Kuan-Changen_US
dc.contributor.authorChu, Tian-Jianen_US
dc.contributor.authorLin, Wen-Yanen_US
dc.contributor.authorChen, Min-Chenen_US
dc.contributor.authorSze, Simon M.en_US
dc.date.accessioned2017-04-21T06:55:10Z-
dc.date.available2017-04-21T06:55:10Z-
dc.date.issued2016-09-26en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.4963672en_US
dc.identifier.urihttp://hdl.handle.net/11536/134225-
dc.description.abstractIn this letter, we demonstrate completely different characteristics with different operating modes and analyze the electrical field effect to confirm the filament dissolution behavior. The device exhibited a larger memory window when using a single voltage sweep method during reset process rather than the traditional double sweep method. The phenomenon was verified by using fast I-V measurement to simulate the two operating methods. A better high resistance state (HRS) will be obtained with a very short rising time pulse, but quite notably, lower power consumption was needed. We proposed the electrical field effect to explain the phenomenon and demonstrate distribution by COMSOL simulation. Published by AIP Publishing.en_US
dc.language.isoen_USen_US
dc.titleConfirmation of filament dissolution behavior by analyzing electrical field effect during reset process in oxide-based RRAMen_US
dc.identifier.doi10.1063/1.4963672en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume109en_US
dc.citation.issue13en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000384747900055en_US
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