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| Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling | 3 |
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| Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling | 0 | 0 | 1 | 0 | 0 | 0 | 0 |
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