標題: Depth-Profiling Electronic and Structural Properties of Cu(In,Ga)(S,Se)(2) Thin-Film Solar Cell
作者: Chiang, Ching-Yu
Hsiao, Sheng-Wei
Wu, Pin-Jiun
Yang, Chu-Shou
Chen, Chia-Hao
Chou, Wu-Ching
電子物理學系
Department of Electrophysics
關鍵字: CIGSSe;solar cell;scanning photoelectron microscope (SPEM);grazing-incidence X-ray powder diffraction (GIXRD);polishing;band diagram;residual stress;ordered defect compound (ODC)
公開日期: 14-九月-2016
摘要: Utilizing a scanning photoelectron microscope (SPEM) and grazing-incidence X-ray powder diffraction (GIXRD), we studied the electronic band structure and the crystalline properties of the pentanary Cu(In,Ga)(S,Se)(2) (CIGSSe) thin-film solar cell as a function of sample depth on measuring the thickness-gradient sample. A novel approach is proposed for studying the depth-dependent information on thin films, which can provide a gradient thickness and a wide cross-section of the sample by polishing process. The results exhibit that the CIGSSe absorber layer possesses four distinct stoichiometries. The growth mechanism of this distinctive compositional: distribution formed by a two stage process is described according to the thermodynamic reaction and the manufacturing, process. On the basis of the depth-profiling results, the gradient profiles of the conduction and valence bands were constructed to elucidate the performance of the electrical properties (in this case, V-oc = 620 mV, J(sc) = 34.6 mA/cm(2), and eta = 14.04%); the valence-band maxima (VBM) measured with a SPEM in the spectroscopic mode coincide with this band-structure model, except for a lowering of the VBM observed in the surface region of the absorber layer due to the ordered defect compound (ODC). In addition, the depth-dependent texturing X-ray diffraction pattern presents the crystalline quality and the residual stress for each depth of a thin-film device. We find that the randomly oriented grains in the bottom region of the absorber layer and the different residual stress between the underlying Mo and the absorber interface, which can deteriorate the electrical performance due to peeling-off effect. An anion interstitial defect can be observed on comparing the anion concentration, of the elemental distribution with crystalline composition; a few excess sulfur atoms insert in interstitial sites at the front side of the absorber layer, whereas the interstitial selenium atoms insert at the back side.
URI: http://dx.doi.org/10.1021/acsami.6b03869
http://hdl.handle.net/11536/134232
ISSN: 1944-8244
DOI: 10.1021/acsami.6b03869
期刊: ACS APPLIED MATERIALS & INTERFACES
Volume: 8
Issue: 36
起始頁: 24152
結束頁: 24160
顯示於類別:期刊論文