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dc.contributor.authorDu, Jun-Pingen_US
dc.contributor.authorWang, Yun-Jiangen_US
dc.contributor.authorLo, Yu-Chiehen_US
dc.contributor.authorWan, Liangen_US
dc.contributor.authorOgata, Shigenobuen_US
dc.date.accessioned2019-04-03T06:39:53Z-
dc.date.available2019-04-03T06:39:53Z-
dc.date.issued2016-09-14en_US
dc.identifier.issn2469-9950en_US
dc.identifier.urihttp://dx.doi.org/10.1103/PhysRevB.94.104110en_US
dc.identifier.urihttp://hdl.handle.net/11536/134233-
dc.description.abstractAccelerated molecular dynamics reveals a mechanism transition and strong temperature dependence of dislocation nucleation from grain boundaries (GBs) in Cu. At stress levels up to similar to 90% of the ideal dislocationnucleation stress, atomic shuffling at the E structural unit in a GB acts as a precursor to dislocation nucleation, and eventually a single dislocation is nucleated. At very high stress levels near the ideal dislocation-nucleation stress, a multiple dislocation is collectively nucleated. In these processes, the activation free energy and activation volume depend strongly on temperature. The strain-rate dependence of the critical nucleation stress is studied and the result shows that the mechanism transition from the shuffling-assisted dislocation-nucleation mechanism to the collective dislocation-nucleationmechanism occurs during the strain rate increasing from 10(-4) s(-1) to 10(10) s(-1).en_US
dc.language.isoen_USen_US
dc.titleMechanism transition and strong temperature dependence of dislocation nucleation from grain boundaries: An accelerated molecular dynamics studyen_US
dc.typeArticleen_US
dc.identifier.doi10.1103/PhysRevB.94.104110en_US
dc.identifier.journalPHYSICAL REVIEW Ben_US
dc.citation.volume94en_US
dc.citation.issue10en_US
dc.citation.spage0en_US
dc.citation.epage0en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000383141100001en_US
dc.citation.woscount9en_US
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