完整後設資料紀錄
DC 欄位語言
dc.contributor.authorLiu, Gui-Shien_US
dc.contributor.authorLiu, Chuanen_US
dc.contributor.authorChen, Jiuan-Huien_US
dc.contributor.authorShieh, Han-Ping D.en_US
dc.contributor.authorYang, Bo-Ruen_US
dc.date.accessioned2017-04-21T06:50:08Z-
dc.date.available2017-04-21T06:50:08Z-
dc.date.issued2016en_US
dc.identifier.isbn978-1-5090-2439-1en_US
dc.identifier.issn2378-8593en_US
dc.identifier.urihttp://hdl.handle.net/11536/134355-
dc.description.abstractSilver nanowires (AgNWs) need to be patterned for using as transparent conductive electrodes (TCEs) in most electronic devices. Herein we propose a versatile technique which can fabricate AgNW patterns with enhanced adhesion to the substrate of polyethylene glycol terephthalate (PET). By using spin-coating, AgNWs were self-assembled into patterns on the surface of polydimethylsiloxane (PDMS) which had been patterned with high contrast of wettability by UV/O-3 exposure. To enhance the adhesion of AgNWs to substrate, the patterned AgNWs were embedded into epoxy resin (EPR) by a facile transferring process. The key to this process is the anti-adhesive groups (CH3) grafted on the oxidized PDMS to assist a clean exfoliation. The AgNW-EPR composite electrode exhibits excellent stability under adhesive tape test and long-term storage.en_US
dc.language.isoen_USen_US
dc.subjectAgNWsen_US
dc.subjectPatternen_US
dc.subjectTransferen_US
dc.subjectAnti-adhesiveen_US
dc.titleStability Enhancement of Silver Nanowire Patterns by Transferring Processen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2016 5TH INTERNATIONAL SYMPOSIUM ON NEXT-GENERATION ELECTRONICS (ISNE)en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.department顯示科技研究所zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.contributor.departmentInstitute of Displayen_US
dc.identifier.wosnumberWOS:000390432600013en_US
dc.citation.woscount0en_US
顯示於類別:會議論文