STUDY OF NANO-TWINNED CU PREPARED BY LOW-TEMPERATURE ELECTRODEPOSITION AND ITS THERMAL STABILITY

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Chen, Yen-Chieh	en_US
dc.contributor.author	Chen, Chih	en_US
dc.date.accessioned	2017-04-21T06:49:18Z	-
dc.date.available	2017-04-21T06:49:18Z	-
dc.date.issued	2016	en_US
dc.identifier.isbn	978-1-5090-4769-7	en_US
dc.identifier.issn	2150-5934	en_US
dc.identifier.uri	http://hdl.handle.net/11536/134597	-
dc.language.iso	en_US	en_US
dc.title	STUDY OF NANO-TWINNED CU PREPARED BY LOW-TEMPERATURE ELECTRODEPOSITION AND ITS THERMAL STABILITY	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016)	en_US
dc.citation.spage	135	en_US
dc.citation.epage	138	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000391819600027	en_US
dc.citation.woscount	0	en_US
顯示於類別：	會議論文