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dc.contributor.authorChu, Li-Weien_US
dc.contributor.authorLin, Chun-Yuen_US
dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorSong, Ming-Hsiangen_US
dc.contributor.authorTseng, Jen-Chouen_US
dc.contributor.authorJou, Chewn-Puen_US
dc.contributor.authorTsai, Ming-Hsienen_US
dc.date.accessioned2017-04-21T06:48:45Z-
dc.date.available2017-04-21T06:48:45Z-
dc.date.issued2014en_US
dc.identifier.isbn978-1-4799-3432-4en_US
dc.identifier.issn0271-4302en_US
dc.identifier.urihttp://hdl.handle.net/11536/134708-
dc.description.abstractAll wireless communication products must meet the reliability specifications during mass production. To prevent from electrostatic discharge (ESD) damages, the ESD protection designs must be added at all input/output pads in chip. Some ESD protection designs with low parasitic capacitance for radio-frequency (RF) applications are reviewed in this paper. Besides, a novel ESD protection design is proposed and realized in a 65nm CMOS process to protect the wideband RF circuits. In this work, diodes are used for ESD protection and inductors are used for high-frequency performance fine tuning. Experimental results of the test circuits have been successfully verified.en_US
dc.language.isoen_USen_US
dc.subjectDiodeen_US
dc.subjectESDen_US
dc.subjectradio-frequency (RF)en_US
dc.subjectT-coilen_US
dc.subjectwidebanden_US
dc.titleESD Protection Design for Wideband RF Applications in 65-nm CMOS Processen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS)en_US
dc.citation.spage1480en_US
dc.citation.epage1483en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000346488600373en_US
dc.citation.woscount1en_US
Appears in Collections:Conferences Paper