完整後設資料紀錄
DC 欄位語言
dc.contributor.authorYeh, Chih-Tingen_US
dc.contributor.authorLiang, Yung-Chihen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2017-04-21T06:49:53Z-
dc.date.available2017-04-21T06:49:53Z-
dc.date.issued2010en_US
dc.identifier.isbn978-1-4244-5271-2en_US
dc.identifier.urihttp://hdl.handle.net/11536/134862-
dc.description.abstractThe diode operated in forward-biased condition has been widely used as an effective on-chip ESD protection device at GHz RF and high-speed I/O pads due to the small parasitic loading effect and high ESD robustness in CMOS integrated circuits (ICs). This work presents new ESD protection diodes realized in the octagon, waffle-hollow, and octagon-hollow layout styles to improve the efficiency of ESD current distribution and to reduce the parasitic capacitance. The new ESD protection diodes can achieve smaller parasitic capacitance under the same ESD robustness level as compared to the waffle diode. Therefore, the signal degradation of GHz RF and high-speed transmission can be reduced due to smaller parasitic capacitance from the new proposed diodes.en_US
dc.language.isoen_USen_US
dc.titleLayout Optimization on ESD Diodes for Giga-Hz RF and High-Speed I/O Circuitsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2010 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN AUTOMATION AND TEST (VLSI-DAT)en_US
dc.citation.spage241en_US
dc.citation.epage244en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000300486600060en_US
dc.citation.woscount0en_US
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