Full metadata record
DC FieldValueLanguage
dc.contributor.authorWeng, Yung-Jinen_US
dc.contributor.authorWeng, Yung-Chunen_US
dc.contributor.authorWong, Yong-Chengen_US
dc.contributor.authorLiu, Hsu-Kangen_US
dc.date.accessioned2017-04-21T06:49:35Z-
dc.date.available2017-04-21T06:49:35Z-
dc.date.issued2009en_US
dc.identifier.isbn978-0-7695-3654-5en_US
dc.identifier.urihttp://dx.doi.org/10.1109/ICSPS.2009.187en_US
dc.identifier.urihttp://hdl.handle.net/11536/135013-
dc.description.abstractLimited by light source wavelength and tight diffraction, nanostructure fabrication is tough, but it needs multiple special and expensive processes (e.g.: E-beam). The common problems are complex and slow processing, expensive manufacturing equipment and material, and it is very unsuitable for mass production; therefore, it\'s of utmost importance to develop a nanoscale, high resolution and costefficient next generation semiconductor process. This study integrated PDMS soft mold, photo resist(SU-8 2035) and vacuum pumping equipment, as well as researched and developed a vacuum-assisted photo resistant microstructure filling technique, and combined soft mold to fabricate waveguide microstructure. Conformal contact was obtained between PDMS soft mold and substrate surface, with low surface free energy, and resistance of sticking to resist in filling. Vacuum equipment was used to enable compact and complete resistant filling, and it can not only greatly increase the effective filling area, but, without residue after filling. There is no need for post treatment removing of the residual layer; it can well lower cost and reduce process time, so that the microstructure component manufacturing technique and application can be more mature.en_US
dc.language.isoen_USen_US
dc.subjectPDMS soft molden_US
dc.subjectConformal contacten_US
dc.subjectolymer optical waveguidesen_US
dc.subjectResidual layeren_US
dc.titleFabrication of Ridge Waveguide Microstructure Using Vacuum-assisted Micromolding Technologyen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/ICSPS.2009.187en_US
dc.identifier.journalPROCEEDINGS OF THE 2009 INTERNATIONAL CONFERENCE ON SIGNAL PROCESSING SYSTEMSen_US
dc.citation.spage960en_US
dc.citation.epage+en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000275782600199en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper