標題: | Wafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Head |
作者: | Hsiao, Sheng-Yi Lee, Chih-Chun Chiu, Yi Shih, Hsi-Fu Chiou, Jin-Chem Shieh, Han-Ping D. Fang, Weileun 電控工程研究所 光電工程學系 Institute of Electrical and Control Engineering Department of Photonics |
關鍵字: | Small form factor;optical pickup head;crystalline plane mirror;wafer level packaging |
公開日期: | 2008 |
摘要: | A MEMS batch assembly process for fabricating small form factor optical pickup head is proposed to minimize the complexity of assembly. Electrical and optical components are sealed in a chamber. A silicon optical bench with a packaged laser diode and crystalline-plane mirrors is demonstrated. |
URI: | http://dx.doi.org/10.1109/OMEMS.2008.4607849 http://hdl.handle.net/11536/135060 |
ISBN: | 978-1-4244-1917-3 |
DOI: | 10.1109/OMEMS.2008.4607849 |
期刊: | 2008 IEEE/LEOS INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS |
起始頁: | 102 |
結束頁: | + |
顯示於類別: | 會議論文 |