Wafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Head

doi:10.1109/OMEMS.2008.4607849

標題:	Wafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Head
作者:	Hsiao, Sheng-Yi Lee, Chih-Chun Chiu, Yi Shih, Hsi-Fu Chiou, Jin-Chem Shieh, Han-Ping D. Fang, Weileun 電控工程研究所光電工程學系 Institute of Electrical and Control Engineering Department of Photonics
關鍵字:	Small form factor;optical pickup head;crystalline plane mirror;wafer level packaging
公開日期:	2008
摘要:	A MEMS batch assembly process for fabricating small form factor optical pickup head is proposed to minimize the complexity of assembly. Electrical and optical components are sealed in a chamber. A silicon optical bench with a packaged laser diode and crystalline-plane mirrors is demonstrated.
URI:	http://dx.doi.org/10.1109/OMEMS.2008.4607849 http://hdl.handle.net/11536/135060
ISBN:	978-1-4244-1917-3
DOI:	10.1109/OMEMS.2008.4607849
期刊:	2008 IEEE/LEOS INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS
起始頁:	102
結束頁:	+
Appears in Collections:	Conferences Paper