標題: Wafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Head
作者: Hsiao, Sheng-Yi
Lee, Chih-Chun
Chiu, Yi
Shih, Hsi-Fu
Chiou, Jin-Chem
Shieh, Han-Ping D.
Fang, Weileun
電控工程研究所
光電工程學系
Institute of Electrical and Control Engineering
Department of Photonics
關鍵字: Small form factor;optical pickup head;crystalline plane mirror;wafer level packaging
公開日期: 2008
摘要: A MEMS batch assembly process for fabricating small form factor optical pickup head is proposed to minimize the complexity of assembly. Electrical and optical components are sealed in a chamber. A silicon optical bench with a packaged laser diode and crystalline-plane mirrors is demonstrated.
URI: http://dx.doi.org/10.1109/OMEMS.2008.4607849
http://hdl.handle.net/11536/135060
ISBN: 978-1-4244-1917-3
DOI: 10.1109/OMEMS.2008.4607849
期刊: 2008 IEEE/LEOS INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS
起始頁: 102
結束頁: +
顯示於類別:會議論文