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dc.contributor.authorHsu, Heng-Tungen_US
dc.contributor.authorChang, Chia-Yuanen_US
dc.contributor.authorHsu, Heng-Shouen_US
dc.contributor.authorChang, Edward Yien_US
dc.date.accessioned2017-04-21T06:49:11Z-
dc.date.available2017-04-21T06:49:11Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-0748-4en_US
dc.identifier.urihttp://hdl.handle.net/11536/135116-
dc.description.abstractTremendous progress has been made recently in the research of novel nanotechnology for future nano-electronic applications. Among all the possible technologies, III-V FETs particularly the heterostructure High Electron Mobility Transistors (HEMT) have demonstrated promising results to be the future device technology for high-speed logic applications. Precise evaluation of the delay performance for HEMT requires highly accurate intrinsic device models extracted from available measurements. In this paper, a rigorous device modelling technique based on 3-D full wave electromagnetic analysis of the device structure is presented. This technique is efficient and accurate, and the determined equivalent circuit model fits the measured S-parameter very well within the frequency range of interest.en_US
dc.language.isoen_USen_US
dc.titleAccurate Performance Evaluation of HEMT Devices for High-Speed Logic Applications through Rigorous Device Modelling Techniqueen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2007 ASIA PACIFIC MICROWAVE CONFERENCE, VOLS 1-5en_US
dc.citation.spage408en_US
dc.citation.epage+en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000261353300105en_US
dc.citation.woscount0en_US
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