完整後設資料紀錄
DC 欄位語言
dc.contributor.authorHung, C. L.en_US
dc.contributor.authorSuz, Y. H.en_US
dc.contributor.authorCheng, Alfred L. -P.en_US
dc.date.accessioned2017-04-21T06:49:10Z-
dc.date.available2017-04-21T06:49:10Z-
dc.date.issued2007en_US
dc.identifier.isbn978-1-4244-1528-1en_US
dc.identifier.issn2157-3611en_US
dc.identifier.urihttp://dx.doi.org/10.1109/IEEM.2007.4419258en_US
dc.identifier.urihttp://hdl.handle.net/11536/135130-
dc.description.abstractThe complexity of IC (Integrated Circuit) design increases as semiconductor fabrication miniaturizes. Assembly of the reusable basic components of the IC design process has become valuable in accelerating development and marketing of new IC applications. As a result, the idea of SIP (Silicon Intellectual Property) has emerged to meet this demand. The purpose of this paper is to develop a SIP valuation model. However, assessing such intangible assets cost high and have a time-consuming negotiation process to safeguard performance. After intensive interviews with SIP providers, we model a SIP valuation process, which incorporates with quality signals, links to the SIP info-mediaries, and augments with the industry dynamics. The results are further suggested to support with Internet SIP malls, which are installed to take the advantages of multimedia interface and real-time archive for facilitating the SIP valuation processes.en_US
dc.language.isoen_USen_US
dc.subjectsilicon intellectual propertyen_US
dc.subjectsemiconductoren_US
dc.subjectvaluationen_US
dc.subjectcontractingen_US
dc.titleModeling the valuation process of silicon intellectual property in the semiconductor industryen_US
dc.typeProceedings Paperen_US
dc.identifier.doi10.1109/IEEM.2007.4419258en_US
dc.identifier.journal2007 IEEE INTERNATIONAL CONFERENCE ON INDUSTRIAL ENGINEERING AND ENGINEERING MANAGEMENT, VOLS 1-4en_US
dc.citation.spage592en_US
dc.citation.epage+en_US
dc.contributor.department資訊管理與財務金融系 註:原資管所+財金所zh_TW
dc.contributor.departmentDepartment of Information Management and Financeen_US
dc.identifier.wosnumberWOS:000253974000120en_US
dc.citation.woscount0en_US
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