The preparation of mesoporous silica ultra-low-k film using ozone ashing treatment

doi:10.1016/j.tsf.2005.01.004

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Cho, AT	en_US
dc.contributor.author	Pan, FM	en_US
dc.contributor.author	Chao, KJ	en_US
dc.contributor.author	Liu, PH	en_US
dc.contributor.author	Chen, JY	en_US
dc.date.accessioned	2014-12-08T15:18:48Z	-
dc.date.available	2014-12-08T15:18:48Z	-
dc.date.issued	2005-07-01	en_US
dc.identifier.issn	0040-6090	en_US
dc.identifier.uri	http://dx.doi.org/10.1016/j.tsf.2005.01.004	en_US
dc.identifier.uri	http://hdl.handle.net/11536/13516	-
dc.description.abstract	The ozone ash treatment has been demonstrated to effectively remove the organic template at 200-300 degrees C as well as to enhance the mechanical strength of mesoporous silica films. The resulting films are of ordered pore structure, strong mechanical strength, and smooth surface. After reacting with hexamethyidisilazane, the silica film has been modified to hydrophobic from hydrophilic and exhibits an ultra-low dielectric constant (k <= 2) and a low leakage current density (10(-7) A/cm(2)) with good electrical reliability. (c) 2005 Elsevier B.V. All rights reserved.	en_US
dc.language.iso	en_US	en_US
dc.subject	ozone ashing	en_US
dc.subject	low-k	en_US
dc.subject	thin film	en_US
dc.subject	mesoporous silica	en_US
dc.title	The preparation of mesoporous silica ultra-low-k film using ozone ashing treatment	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1016/j.tsf.2005.01.004	en_US
dc.identifier.journal	THIN SOLID FILMS	en_US
dc.citation.volume	483	en_US
dc.citation.issue	1-2	en_US
dc.citation.spage	283	en_US
dc.citation.epage	286	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000229681700047	-
dc.citation.woscount	12	-
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