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dc.contributor.authorLin, Chun-Yuen_US
dc.contributor.authorFan, Mei-Lianen_US
dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorChu, Li-Weien_US
dc.contributor.authorTseng, Jen-Chouen_US
dc.contributor.authorSong, Ming-Hsiangen_US
dc.date.accessioned2017-04-21T06:48:42Z-
dc.date.available2017-04-21T06:48:42Z-
dc.date.issued2014en_US
dc.identifier.isbn978-1-4799-3317-4en_US
dc.identifier.issn1541-7026en_US
dc.identifier.urihttp://hdl.handle.net/11536/135273-
dc.description.abstractTo protect the radio-frequency (RF) integrated circuits from the electrostatic discharge (ESD) damage in nanoscale CMOS process, the ESD protection circuit must be carefully designed. In this work, stacked diodes with embedded silicon-controlled rectifier (SCR) to improve ESD robustness was proposed for RF applications. Experimental results in 65-nm CMOS process show that the proposed design can achieve low parasitic capacitance, low turn-on resistance, and high ESD robustness.en_US
dc.language.isoen_USen_US
dc.subjectDiodeen_US
dc.subjectelectrostatic discharge (ESD)en_US
dc.subjectradio-frequency (RF)en_US
dc.subjectsilicon-controlled rectifier (SCR)en_US
dc.titleImproving ESD Robustness of Stacked Diodes with Embedded SCR for RF Applications in 65-nm CMOSen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUMen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000343833200134en_US
dc.citation.woscount0en_US
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