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dc.contributor.authorHuang, Chun-Weien_US
dc.contributor.authorLiu, Kai-Jenen_US
dc.contributor.authorHuang, Yu-Jungen_US
dc.contributor.authorChen, Ming-Kunen_US
dc.contributor.authorLin, Yi-Lungen_US
dc.contributor.authorKer, Ming-Douen_US
dc.date.accessioned2017-04-21T06:50:01Z-
dc.date.available2017-04-21T06:50:01Z-
dc.date.issued2012en_US
dc.identifier.isbn978-1-4673-5085-3en_US
dc.identifier.issn2373-6852en_US
dc.identifier.urihttp://hdl.handle.net/11536/135442-
dc.description.abstractThe scaling of semiconductor technology together with 3D IC stacking integration make it possible for many portable electronics to process large amount of multimedia data. AC-coupling enables chip placed face-to-face for signal transmission using close-field capacitive coupling. A high performance system design using AC coupled interconnect (ACCI) technology not only achieves shorter and faster interconnection between dies but also increases packaging density. This paper describes a chip-to-chip circuit design suitable for high-speed 3DIC interconnected applications. The AC-Coupled face-to-face (F2F) chip was simulated using HSPICE with TSMC 0.18-mu m 1P6M CMOS technology process file under a 1.8 V supply voltage. The simulation results indicated the proposed circuit with the self-test characteristics can achieve differential signal transmission up to 2.5 Gbps.en_US
dc.language.isoen_USen_US
dc.subjectthree-dimensional integrated circuit (3D IC)en_US
dc.subjectAC-Coupleden_US
dc.subjecthigh-speed interconnecteden_US
dc.subjectdifferential signal transmissionen_US
dc.titleDesign of AC-Coupled Circuit for High-speed Interconnectsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2012 IEEE GLOBAL HIGH TECH CONGRESS ON ELECTRONICS (GHTCE)en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000318807300018en_US
dc.citation.woscount0en_US
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