Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yang, Chen | en_US |
dc.contributor.author | Wu, Sung-Yueh | en_US |
dc.contributor.author | Glick, Casey | en_US |
dc.contributor.author | Choi, Yun Seok | en_US |
dc.contributor.author | Hsu, Wensyang | en_US |
dc.contributor.author | Lin, Liwei | en_US |
dc.date.accessioned | 2017-04-21T06:49:12Z | - |
dc.date.available | 2017-04-21T06:49:12Z | - |
dc.date.issued | 2015 | en_US |
dc.identifier.isbn | 978-1-4799-7955-4 | en_US |
dc.identifier.issn | 1084-6999 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/135623 | - |
dc.description.abstract | We present three-dimensional (3D) micro-scale electrical components and systems by means of 3D printing and a liquid-metal-filling technique. The 3D supporting polymer structures with hollow channels and cavities are fabricated from inkjet printing. Liquid metals made of silver particles suspension in this demonstration are then injected into the hollow paths and solidified to form metallic elements and interconnects with high electrical conductivity. In the proof-of-concept demonstrations, various radio-frequency (RF) passive components, including 3D-shaped inductors, capacitors and resistors are fabricated and characterized. High-Q inductors and capacitors up to 1 GHz have been demonstrated. This work establishes an innovative way to construct arbitrary 3D electrical systems with efficient and labor-saving processes. | en_US |
dc.language.iso | en_US | en_US |
dc.title | 3D PRINTED RF PASSIVE COMPONENTS BY LIQUID METAL FILLING | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2015 28TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2015) | en_US |
dc.citation.spage | 261 | en_US |
dc.citation.epage | 264 | en_US |
dc.contributor.department | 交大名義發表 | zh_TW |
dc.contributor.department | National Chiao Tung University | en_US |
dc.identifier.wosnumber | WOS:000370382900070 | en_US |
dc.citation.woscount | 2 | en_US |
Appears in Collections: | Conferences Paper |