完整後設資料紀錄
DC 欄位語言
dc.contributor.authorYang, Chenen_US
dc.contributor.authorWu, Sung-Yuehen_US
dc.contributor.authorGlick, Caseyen_US
dc.contributor.authorChoi, Yun Seoken_US
dc.contributor.authorHsu, Wensyangen_US
dc.contributor.authorLin, Liweien_US
dc.date.accessioned2017-04-21T06:49:12Z-
dc.date.available2017-04-21T06:49:12Z-
dc.date.issued2015en_US
dc.identifier.isbn978-1-4799-7955-4en_US
dc.identifier.issn1084-6999en_US
dc.identifier.urihttp://hdl.handle.net/11536/135623-
dc.description.abstractWe present three-dimensional (3D) micro-scale electrical components and systems by means of 3D printing and a liquid-metal-filling technique. The 3D supporting polymer structures with hollow channels and cavities are fabricated from inkjet printing. Liquid metals made of silver particles suspension in this demonstration are then injected into the hollow paths and solidified to form metallic elements and interconnects with high electrical conductivity. In the proof-of-concept demonstrations, various radio-frequency (RF) passive components, including 3D-shaped inductors, capacitors and resistors are fabricated and characterized. High-Q inductors and capacitors up to 1 GHz have been demonstrated. This work establishes an innovative way to construct arbitrary 3D electrical systems with efficient and labor-saving processes.en_US
dc.language.isoen_USen_US
dc.title3D PRINTED RF PASSIVE COMPONENTS BY LIQUID METAL FILLINGen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2015 28TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2015)en_US
dc.citation.spage261en_US
dc.citation.epage264en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.identifier.wosnumberWOS:000370382900070en_US
dc.citation.woscount2en_US
顯示於類別:會議論文