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dc.contributor.authorHuang, Po-Shengen_US
dc.contributor.authorWang, Chi-Chuanen_US
dc.date.accessioned2017-04-21T06:49:50Z-
dc.date.available2017-04-21T06:49:50Z-
dc.date.issued2015en_US
dc.identifier.isbn978-0-7918-5687-1en_US
dc.identifier.urihttp://hdl.handle.net/11536/135683-
dc.description.abstractThe present study proposed a V-shape cannelure structure applicable for electronic cooling thermal module. Initially, simulations are made to find out the best configurations, followed by an actual implementation and verification. From the experimental verification, it is found that the proposed modified thermal module can appreciably reduce the heat sink volume (up to 30%) and still maintain a lower base temperature than the original plain fin design. Yet it is found that an overall 16% improvement of the heat transfer performance can be achieved.en_US
dc.language.isoen_USen_US
dc.titleA Study on Heat Sink Performance Using V-Shaped Cannelure Structure Finen_US
dc.typeProceedings Paperen_US
dc.identifier.journalPROCEEDINGS OF THE ASME 13TH INTERNATIONAL CONFERENCE ON NANOCHANNELS, MICROCHANNELS, AND MINICHANNELS, 2015en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000374197900094en_US
dc.citation.woscount0en_US
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