Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Shen, Yu-An | en_US |
dc.contributor.author | Chen, Chih | en_US |
dc.date.accessioned | 2017-04-21T06:50:16Z | - |
dc.date.available | 2017-04-21T06:50:16Z | - |
dc.date.issued | 2015 | en_US |
dc.identifier.isbn | 978-1-4673-8356-1 | en_US |
dc.identifier.issn | 2150-5934 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/135721 | - |
dc.description.abstract | Grain size and orientation of microbump play very important roles on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.5Ag/Cu and Ni/Sn-2.5Ag/Ni microbumps assembled by thermal-compression bonding are investigated grain size and orientation by electron-backscattering diffraction inverse pole figure. Cu/Sn-2.5Ag/Cu microbumps appear much more single crystal-like structures than Ni/Sn-2.5Ag/Ni. By the distribution of grain size, a large quantity of the small Sn grains appears in Ni/Sn-2.5Ag/Ni microbump due to the very low solubility of Ni in Sn. Finally, Cu/Sn-2.5Ag/Cu microbumps possess more grain areas with the lower angles between c-axis and normal dirction. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Study of Grain Size and Orientation of 30 mu m Solder Microbumps Bonded by Thermal Compression | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) | en_US |
dc.citation.spage | 204 | en_US |
dc.citation.epage | 206 | en_US |
dc.contributor.department | 材料科學與工程學系 | zh_TW |
dc.contributor.department | Department of Materials Science and Engineering | en_US |
dc.identifier.wosnumber | WOS:000377942900042 | en_US |
dc.citation.woscount | 0 | en_US |
Appears in Collections: | Conferences Paper |