標題: Study of Grain Size and Orientation of 30 mu m Solder Microbumps Bonded by Thermal Compression
作者: Shen, Yu-An
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 2015
摘要: Grain size and orientation of microbump play very important roles on thermal-cycling test and electromigration failure. In this study, Cu/Sn-2.5Ag/Cu and Ni/Sn-2.5Ag/Ni microbumps assembled by thermal-compression bonding are investigated grain size and orientation by electron-backscattering diffraction inverse pole figure. Cu/Sn-2.5Ag/Cu microbumps appear much more single crystal-like structures than Ni/Sn-2.5Ag/Ni. By the distribution of grain size, a large quantity of the small Sn grains appears in Ni/Sn-2.5Ag/Ni microbump due to the very low solubility of Ni in Sn. Finally, Cu/Sn-2.5Ag/Cu microbumps possess more grain areas with the lower angles between c-axis and normal dirction.
URI: http://hdl.handle.net/11536/135721
ISBN: 978-1-4673-8356-1
ISSN: 2150-5934
期刊: 2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)
起始頁: 204
結束頁: 206
Appears in Collections:Conferences Paper