標題: Nondestructive Optical Inspection System for the Dicing Street Quality of Copper/Low-k Wafer
作者: Lin, Sheng-Feng
Chen, Cheng-Huan
Lo, Cheng-Yao
光電工程學系
顯示科技研究所
Department of Photonics
Institute of Display
關鍵字: nondestructive optical inspection;sidewall crack;scattering;copper/low-k wafer
公開日期: 2015
摘要: To resolve the issue in detecting sidewall crack defect mode in the die singulation of copper/low-k wafer after laser pre-groove/cleaning process, we combine a dedicated optical system with automatic optical inspection system in the production line for the nondestructive wafer-by-wafer optical inspection system to inspect the dicing street quality of copper/low-k wafer. Experiment shows that the sidewall crack defect can be clearly identified with the proposed inspection system and it is potentially applicable for the production line.
URI: http://hdl.handle.net/11536/135725
ISBN: 978-1-5090-0332-7
期刊: 2015 IEEE 21ST INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME)
起始頁: 77
結束頁: 81
顯示於類別:會議論文