標題: | Nondestructive Optical Inspection System for the Dicing Street Quality of Copper/Low-k Wafer |
作者: | Lin, Sheng-Feng Chen, Cheng-Huan Lo, Cheng-Yao 光電工程學系 顯示科技研究所 Department of Photonics Institute of Display |
關鍵字: | nondestructive optical inspection;sidewall crack;scattering;copper/low-k wafer |
公開日期: | 2015 |
摘要: | To resolve the issue in detecting sidewall crack defect mode in the die singulation of copper/low-k wafer after laser pre-groove/cleaning process, we combine a dedicated optical system with automatic optical inspection system in the production line for the nondestructive wafer-by-wafer optical inspection system to inspect the dicing street quality of copper/low-k wafer. Experiment shows that the sidewall crack defect can be clearly identified with the proposed inspection system and it is potentially applicable for the production line. |
URI: | http://hdl.handle.net/11536/135725 |
ISBN: | 978-1-5090-0332-7 |
期刊: | 2015 IEEE 21ST INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME) |
起始頁: | 77 |
結束頁: | 81 |
顯示於類別: | 會議論文 |