A Low-Cost Broadband Bondwire Interconnect for THz Heterogeneous System Integration

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Li, Chun-Hsing	en_US
dc.contributor.author	Lai, Chih-Wei	en_US
dc.contributor.author	Yan, Tzu-Chao	en_US
dc.contributor.author	Kuo, Chien-Nan	en_US
dc.date.accessioned	2017-04-21T06:49:12Z	-
dc.date.available	2017-04-21T06:49:12Z	-
dc.date.issued	2015	en_US
dc.identifier.isbn	978-1-4799-8275-2	en_US
dc.identifier.issn	0149-645X	en_US
dc.identifier.uri	http://hdl.handle.net/11536/135829	-
dc.description.abstract	A low-cost broadband bondwire interconnect is proposed for THz heterogeneous system integration. A transversal path composed of two transmission lines and a bondwire is introduced to effectively reduce the bondwire effect of an original signal path consisted of a single bondwire only. Simulation results indicate that the return loss and insertion loss can be better than 15 dB and 2.3 dB from dc to 456 GHz, respectively. Measured interconnect loss is around 0 dB to 1.5 dB from 320 to 340 GHz.	en_US
dc.language.iso	en_US	en_US
dc.subject	Bondwire	en_US
dc.subject	broadband	en_US
dc.subject	interconnect	en_US
dc.subject	THz	en_US
dc.subject	heterogeneous integration	en_US
dc.title	A Low-Cost Broadband Bondwire Interconnect for THz Heterogeneous System Integration	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	2015 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS)	en_US
dc.contributor.department	電機工程學系	zh_TW
dc.contributor.department	Department of Electrical and Computer Engineering	en_US
dc.identifier.wosnumber	WOS:000370722900149	en_US
dc.citation.woscount	0	en_US
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