完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Yan, Tzu-Chao | en_US |
dc.contributor.author | Li, Chun-Hsing | en_US |
dc.contributor.author | Lai, Chih-Wei | en_US |
dc.contributor.author | Chen, Wei-Cheng | en_US |
dc.contributor.author | Chao, Tzu-Yuan | en_US |
dc.contributor.author | Kuo, Chien-Nan | en_US |
dc.date.accessioned | 2017-04-21T06:49:42Z | - |
dc.date.available | 2017-04-21T06:49:42Z | - |
dc.date.issued | 2014 | en_US |
dc.identifier.isbn | 978-1-4799-4089-9 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/135867 | - |
dc.description.abstract | This paper presents a THz imaging system composed of a signal source and a signal sensor in CMOS technology The signal source integrates a 338 GHz oscillator in 40-nm CMOS and an antenna array on a Benzocyclobutene (BCB) carrier using the SoP (System-on-Package) technique. The measured EIRP achieves +8 dBm. The signal sensor is implemented in 0.18 mu m CMOS. The measured maximum responsivity is 632 kV/W at 332 GHz. The signal source and signal sensor consume dc power of 37.5 mW and 7.92 mW, respectively. The resolution of the proposed THz imaging system is 4 mm. | en_US |
dc.language.iso | en_US | en_US |
dc.subject | THz imaging system | en_US |
dc.subject | CMOS | en_US |
dc.subject | signal source | en_US |
dc.subject | signal sensor | en_US |
dc.subject | System-on-Package (SoP) | en_US |
dc.title | CMOS THz Transmissive Imaging System | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2014 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC) | en_US |
dc.citation.spage | 169 | en_US |
dc.citation.epage | 172 | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000380484900043 | en_US |
dc.citation.woscount | 1 | en_US |
顯示於類別: | 會議論文 |