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dc.contributor.authorLi, Yimingen_US
dc.contributor.authorChang, Han-Tungen_US
dc.contributor.authorLai, Chun-Ningen_US
dc.contributor.authorChao, Pei-Jungen_US
dc.contributor.authorChen, Chieh-Yangen_US
dc.date.accessioned2017-04-21T06:48:19Z-
dc.date.available2017-04-21T06:48:19Z-
dc.date.issued2015en_US
dc.identifier.isbn978-1-4673-9894-7en_US
dc.identifier.urihttp://hdl.handle.net/11536/136039-
dc.description.abstractIn this work, process variation effect (PVE), work function fluctuation (WKF), and random dopant fluctuation (RDF) on 10-nm high-kappa/metal gate gate-all-around silicon nanowire MOSFET devices using full-quantum-mechanically validated and experimentally calibrated device simulation are studied. The small aspect ratio device has greater immunity of RDF, while suffers from PVE and WKF.en_US
dc.language.isoen_USen_US
dc.titleProcess Variation Effect, Metal-Gate Work-Function Fluctuation and Random Dopant Fluctuation of 10-nm Gate-All-Around Silicon Nanowire MOSFET Devicesen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)en_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.department傳播研究所zh_TW
dc.contributor.department分子醫學與生物工程研究所zh_TW
dc.contributor.department電機學院zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.contributor.departmentInstitute of Communication Studiesen_US
dc.contributor.departmentInstitute of Molecular Medicine and Bioengineeringen_US
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000380472500221en_US
dc.citation.woscount0en_US
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